EPON Resin 164 systems exhibit high Tg's and heat deflection temperatures (HDT's) and better retention of properties at elevated temperatures (see Table 2). They display superior strength and modulus which translates to greater stiffness and rigidity and an ability to withstand higher. EPONTM Resin 828 is an undiluted clear difunctional bisphenol A/epichlorohydrin derived liquid epoxy resin. When cross-linked or hardened with appropriate curing agents, very good mechanical, adhesive, dielectric and chemical resistance properties are obtained. As a result, the viscosity of this product is lower than standard bisphenol A liquid resins without the use of diluents or modifiers. Resin/curing agent systems based on EPON 825 have greater clarity, chemical resistance. With EPON laminates of this type, either boiling in water or aging at 95-100% relative humidity and 100F for one hour caused a greater loss in strength than soaking for 30 days.
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